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This year DevCom Ltd. will participate in the largest domestic trade fair focused on Automotive Aftermarket in the Czech Republic.

You can see the current series of TS PRO, ODB HEAD 3 in 1, CAMERA CAN MODULE and other innovations in diagnostics and telematics !!!

  Please accept a cordial invitation to our booth.

DATE: 1. 6. 2019, 9.30 a. m. - 7 p.m.

PVA EXPO PRAHA, Hala č. 3 a 4,
Beranových 667, 199 00 Praha 9 – Letňany



Automotive systems